| http://www.w3.org/ns/prov#value | - 20120104621POWER PACKAGE MODULE AND METHOD FOR FABRICATING THE SAME - Disclosed herein are a power package module and a method for fabricating the same, including: a base substrate; a plurality of high power chips and a plurality of low power chips electrically connected to the base substrate; and a plurality of metal lead plates electrically connecting the plurality of high power chips and the pl
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