| http://www.w3.org/ns/prov#value | - BACKGROUND OF THE INVENTION(1) Field of the Invention The present invention relates to the field of fabricating integrated circuits, and particularly the field of via or contact etching of insulating films formed in semiconductor devices. (2) Prior Art In the fabrication of integrated circuits, it is often desired to etch certain areas of a film formed in a semiconductor substrate used as an insul
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