About: http://webisa.webdatacommons.org/255396916

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Semiconductor packages such as ball grid array (BGA) package, chip scale package and micro ball grid array package reflect the trend towards of miniaturization and thinness in packaging.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com