| http://www.w3.org/ns/prov#value | - ional vinyl compounds. [0009] In another embodiment, this invention is the cured adhesive that results from the just described curable adhesive composition. [0010] In another embodiment, this invention is a electronic assembly comprising an electronic component bonded to a substrate with a cured adhesive composition prepared from a composition comprising one or more allylated amide compounds, a cu
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