http://www.w3.org/ns/prov#value | - cal), organo silsesquioxane, hydrido silsesquioxane, hydrido-organo silsesquioxane copolymer, siloxane, silsesquioxane or other spin-on materials with a low dielectric constant (preferably less than 3.5 and more preferably less than 3.0), and a relatively low CMP polish rate in standard liner polish processes (preferably less than 350 ???/min, more preferably less than 150 ???/min.).
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