| http://www.w3.org/ns/prov#value | - ial which is flexible, i.e., bendable in the case of the above described embodiment, the resin film 10 can be made of a rigid material such as a glass epoxy, an aramid-epoxy. [0241] Also, a BT resin, a PPO, a PPE and the like can be used as the material for forming the above described resin film 10. [0242] Next, the manufacturing process of the multilayer wiring board assembly component as describ
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