About: http://webisa.webdatacommons.org/258200153

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	First group of vias 255 thus provides for a good thermal and electrical connection from semiconductor device chip 100 to heat spreader 290 due to the presence of an electrical and thermal conductor such as copper.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com