| http://www.w3.org/ns/prov#value | - wn in FIG. 3 in process (d). [0134] As described above, the effect of the present invention can be confirmed for both treatments by the fact that the seed layer can be formed by using the plating method in accordance with the present invention without using a dry method, such as the sputtering method, and a small hole can be easily filled with copper by electroplating.
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