| http://www.w3.org/ns/prov#value | - By using sputtering to apply Cu, Al, Ta, Au, CrSi or other conductive metals, and tantalum oxidation, photolithography, and various chemical etches to form dielectric, conductor, and resistor features, it is possible to form passive circuits on a polyimide film with the total thickness of the device being less than 4 mils thick. [0051]FIG. 1 shows a diagrammatic side view of the invention 126.
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