| http://www.w3.org/ns/prov#value | - 20110175239SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME - Disclosed herein is a semiconductor device, including: a mount body having a first principal surface on which a wiring pattern is formed; a semiconductor chip mounted above the principal surface of the mount body on which the wiring pattern is formed; an underfill material filled between the mount body and the semiconductor c
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