| http://www.w3.org/ns/prov#value | - Through SEMATECH's 3D Interconnect program and workshops such as this, attendees can compare progress and develop an assessment on integration approaches, process architectures, and tool sets that will make 3D-TSV commercially viable.The 2007 ITRS roadmap forecasts high density TSV pitches ranging from approximately 4.5 microns in 2008 to approximately 2.5 microns in 2012.
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