PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • FIG. 1A is a partially schematic, cross-sectional side view of a molding apparatus for encapsulating microelectronic devices using a transfer mold process in accordance with the prior art.
http://www.w3.org/ns/prov#wasQuotedFrom
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