| http://www.w3.org/ns/prov#value | - 5B is a view for explaining a case where a molten processed region remains in an edge part on the rear face side of a cut surface of a semiconductor chip after the step of grinding the semiconductor substrate in accordance with Example 1, while a fracture does not reach the front face before the step of grinding the semiconductor substrate; FIG. 26A is a sectional view of a marginal part of the se
|
