About: http://webisa.webdatacommons.org/263374032

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Accordingly, there is a need for a reliable flip chip bump interconnect which takes care of the problems associated with changing temperature conditions, is capable of providing high density fine pitch interconnection, and is affordable.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com.au