| http://www.w3.org/ns/prov#value | - 5;FIG. 7 is a plan view showing the structure on a block sealing member side of the assembled product illustrated in FIG. 5;FIG. 8 is a front view showing the structure of the assembled product illustrated in FIG. 6;FIG. 9 is a plan view showing a structural example of a substrate holding jig used in the semiconductor device manufacturing method of the first embodiment;FIG. 10 is a side view show
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