| http://www.w3.org/ns/prov#value | - cuit structure, and a bonding pad connected to the pad through the opening, a wire bonded to the bonding pad and to a lead of the lead frame, a polymer material, such as epoxy based material, benzocyclobutane (BCB) or polyimide, enclosing the die pad, an inner partition of the lead, the semiconductor chip and the wire.
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