| http://www.w3.org/ns/prov#value | - With reference to FIG. 4 in which like reference numerals refer to like features in FIG. 3 and at a subsequent fabrication stage, the sacrificial mask 16 is removed by an etch process, such as a wet etch process using an aqueous mixture of nitric acid (HNO3) and hydrofluoric acid (HF), that etches the sacrificial mask 16 selective to the material of the patterned hardmask 14 and the oxide layer 12
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