| http://www.w3.org/ns/prov#value | - In order to facilitate fabrication of one or more dielectric jackets 52 in accordance with the method of the present invention with apparatus 80, a data file representative of the size, configuration, thickness and surface topography of, for example, a particular type and design of semiconductor device 10 or other substrate upon which one or more jackets 52 are to be mounted is placed in the memor
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