| http://www.w3.org/ns/prov#value | - In a third embodiment of the present invention, the core material is a conductive material having a thin outer layer of solder material. [0033] In each embodiment of the present invention, the use of a solid core having a thin layer of another metal or solder thereover allows the reflow soldering of the semiconductor device to the substrate without the use of additional solder or solder flux being
|
