| http://www.w3.org/ns/prov#value | - In addition, since the flow prevention film DM is deposited on an area other than a connection area, the adhesion to the under-filling material AF can also be increased. [0166] The structure of this embodiment comprises the semiconductor element 73, the conductive patterns 72A to 72C, the heat discharge electrodes 72D, the under-filling material AF and the insulating resin 71 in which all of these
|
