| http://www.w3.org/ns/prov#value | - In FIGS. 1 and 2, the reference numeral 11 represents an intermediate ceramic insulating substrate, 12 a semiconductor chip such as LSI, 13 a thermal conductive ceramic member, 14 an electric conductive pin, 15 a multi-layered organic circuit board produced from an organic insulating material, 16 a solder for bonding the contacts on the front face of the intermediate ceramic insulating substrate a
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