| http://www.w3.org/ns/prov#value | - In the structure of the first embodiment shown in FIG. 1, there is a method of lowering the bonding temperature in which solder is supplied to the first connection pad, a metal protruded electrode containing Au as a main component is provided by ball bonding method on the first electrode 3 of the first chip 1, the pad and the electrode are connected by flip chip method and Au-solder bonding is per
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