| http://www.w3.org/ns/prov#value | - In particular, in case of a circuit pattern where the parts such as semiconductor element or the like are obliged to be arranged and positioned to a portion close to a peripheral position of the metal circuit plate, the molten solder is liable to flow out to a portion between the adjacent circuit patterns thereby to cause solder-voids and many soldering-defects, so that there has been also posed a
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