| http://www.w3.org/ns/prov#value | - ic modulus, the porosity and other properties of a polishing pad of a CMP machine to use the measured properties to decide the time when the pad is exchanged, or the like.Japanese Unexamined Patent Publication No. Hei 11 (1999)-207572 or corresponding U.S. Pat. No. 5,934,974 discloses a system of monitoring the abrasion of a polishing pad of a CMP machine with a noncontact sensor while the machine
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