| http://www.w3.org/ns/prov#value | - In the package 210 of FIG. 8, bond pads 30 on the active surface 22 of a first-level semiconductor device 20??? are attached to contact areas 59 on the active surface 42 of a second-level semiconductor device 40 by discrete conductive elements 36A, shown comprising conductive balls, although bumps, pillars, columns, regions of films, and other structures formed from metal, conductive or conductor-
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