| http://www.w3.org/ns/prov#value | - In another configuration, the topmost surface of the LED chip possesses two bondpads, and electrical connection to both the LED anode and cathode is made by wirebond 211. [0100] LED chips suitable for use in the present invention are made by companies such as Hewlett-Packard, Nichia Chemical, Siemens Optoelectronics, Sharp, Stanley, Toshiba, LiteOn, Cree Research, Toyoda Gosei, Showa Denko, Tyntec
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