| http://www.w3.org/ns/prov#value | - In the method of fabricating the multilayer PCB according to the second embodiment of the present invention, the first metal carrier 202 a, having a low CTE, such as SUS304, Invar, or Kovar, is used, in order to protect the substrate from deformation, including extension or warping, due to changes in atmospheric temperature or differences in process temperatures, and thus the PCB may be stably fab
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