| http://www.w3.org/ns/prov#value | - In an embodiment, the printed circuit layer 330 is formed by depositing a layer of silver ink over the bottom surface 335 of layer 306, and then performing a patterning process including the steps of photoresistive masking and etching to precisely form the conductive segments 332 and pads 334 in a predetermined pattern to achieve desired circuit connections and to assure adequate physical distance
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