| http://www.w3.org/ns/prov#value | - In this latter case, factors of the etch release process including the position, number and size of the etch channels 48; the chemical composition of the etchant; and the time for etching can be selected to limit a lateral extent of etching of the sacrificial material, thereby leaving portions of the sacrificial material surrounding the polysilicon studs 28 or the other fixed structural elements o
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