| http://www.w3.org/ns/prov#value | - In this manner, the reduced image of the original pattern 2 is exposed in each shot region on the wafer W and then, the wafer W is developed, process such as etching is carried out, and a circuit pattern of a certain layer of an electronic device is formed in each shot region on the wafer W. After such pattern forming steps are repeated, bonding and dicing steps and the like are carried out and th
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