| http://www.w3.org/ns/prov#value | - In one aspect the invention features a multi-package module having stacked first (???bottom???) and second (???top???) packages, each package including a die attached to a substrate and connected to the substrate by wire bonding, in which the top package substrate and the bottom package substrate are interconnected by wire bonding, and in which the bottom package is a flip chip package in a die-up
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