| http://www.w3.org/ns/prov#value | - In addition, there is a method to separate an element layer from a supporting substrate by providing a peeling layer containing silicon between the element layer and the supporting substrate and removing the peeling layer with the use of gas containing halogen fluoride (chemical formula: XFn (X is halogen other than fluorine and n is an integer number) (see Reference 2: Japanese Patent Application
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