| http://www.w3.org/ns/prov#value | - DISCLOSURE OF THE INVENTION [0013] An aspect of the present invention is a polishing composition suitable for planarizing metals, such as Cu and Cu alloys, with significantly reduced dishing and significantly reduced sensitivity to overpolish. [0014] According to the present invention, the foregoing and other aspects are achieved in part by a composition for chemical mechanical polishing (CMP) a s
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