| http://www.w3.org/ns/prov#value | - In this state, the module carrier 1 is additionally connected to the card carrier 11 by an adhesive bond. [0042] Both the base plate 2 and the card carrier 11 can be produced from a plastic such as glass fiber reinforced epoxy resin, PVC, PET, PC and/or ABS. The transmitting/receiving coil 3 can be applied to the base plate 2 using an etching, winding, laying or printing technique. [0043] As can b
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