| http://www.w3.org/ns/prov#value | - nced Technology Materials, Inc.Composition and method for low temperature deposition of silicon-containing films such as films including silicon, silicon nitride, silicon dioxide and/or silicon-oxynitrideUS796025612 May 201014 Jun 2011Applied Materials, Inc.Use of CL2 and/or HCL during silicon epitaxial film formationUS802962031 Jul 20074 Oct 2011Applied Materials, Inc.Methods of forming carbon-co
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