| http://www.w3.org/ns/prov#value | - One embodiment according to the present invention is a method for fabricating an integrated electronic device having an electric connection between...http://www.google.com/patents/US6764938?utm_source=gb-gplus-sharePatent US6764938 - Integrated electronic device having flip-chip connection with circuit board and fabrication method thereofAdvanced Patent SearchPublication numberUS6764938 B2Publicat
|
