| http://www.w3.org/ns/prov#value | - And, etching is effected by using a known technique such as photolithography to remain required portions alone. [0137] Lastly, as shown in FIG. 10D, the silicone substrate 17 is removed by an etching method using chemical mechanical polishing (CMP) or TMAH. Alternatively, the silicone wafer may be removed by exposing the substrate to XeF2 gas. [0138]FIG. 12A is a perspective view of the separation
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