| http://www.w3.org/ns/prov#value | - In particular, it will focus on the development of lithography techniques such as direct self-assembly (DSA) and double/multiple patterning to facilitate scaling of ArF Deep Ultraviolet (DUV) dry and immersion down to 14nm and beyond, targeting advanced applications including logic, high density memory, embedded non-volatile memory, high-speed electronics and nanophotonics, and nano-electromechani
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