| http://www.w3.org/ns/prov#value | - In such a case, other than in the square region surrounded by the four-side bumps 152, . . . , 152 within the bonding surface of the IC chip 151 on which the passivation film 159 is disposed, the bonding material 155 flows at a higher flow speed at positions between the four-side bumps 152, . . . , 152 as well as at positions outer than the four-side bumps 152, . . . , 152, i.e., in the peripheral
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