| http://www.w3.org/ns/prov#value | - In another embodiment, the temporary support material 107 may comprise a polymer such as high temperature polyimide, a photoresist, parylene such as parylene C or any combinations thereof. [0031] Furthermore, as shown in FIG. 1, the air bridge structures 106 are formed above the upper surface 108 of the substrate 102 to electrically interconnect a first and a second exposed contact 128 a, 128 b ex
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