| http://www.w3.org/ns/prov#value | - On the other hand, if the polishing rate ratio of the polishing slurry (interconnect metal/barrier metal) is more than 3, i.e., if the polishing rate for the interconnect metal film is considerably larger than that for the barrier metal film, the interconnect metal within the concave is excessively polished, resulting in problems such as tendency to dishing, short-circuit because the polishing rat
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