| http://www.w3.org/ns/prov#value | - naChemical mechanical polishing slurry for metallic thin filmUS594869723 May 19967 Sep 1999Lsi Logic CorporationCatalytic acceleration and electrical bias control of CMP processingUS595828826 Nov 199628 Sep 1999Cabot CorporationChemical mechanical polishing metal layer containing substrate by using a hydrogen peroxide or monopersulfate oxidizer, a catalyst containing ferric nitrate or other metal
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