| http://www.w3.org/ns/prov#value | - In a preferred form, the heat conductive structure to be included in the bond in accordance with the invention is in the form of a screen 60 woven of a metal wire of high thermal conductivity such as copper or a copper alloy (or silver or gold if the additional heat conductivity of such metals justifies their cost and accommodation of their greater malleability can be accommodated in a particularl
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