| http://www.w3.org/ns/prov#value | - One embodiment of the present invention is a method for making metallic interconnects comprising: (a) forming a patterned insulating layer on a substrate, the patterned insulating layer including at least one opening and a field surrounding the at least one opening; (b) depositing a barrier layer over the field and inside surfaces of the at least one opening; (c) depositing a first seed layer over
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