| http://www.w3.org/ns/prov#value | - In such a case, the bump electrode may be used only for the use of thermal radiation by a method of connection with the base (gate) or the collector (drain), or of interposing the insulating film without use as the electrode.In the present embodiment, a face to be connected with the reverse face of the semiconductor chip becomes directly a heat sink, but the whole or one portion including the port
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