| http://www.w3.org/ns/prov#value | - n an integrated circuit, depositing a conductive layer contacting the dielectric layer; forming an address decoder in the substrateUS742940210 Dec 200430 Sep 2008Applied Materials, Inc.Depositing a barrier layer on the substrate, such as a titanium or tantalum containing barrier layer and depositing a ruthenium layer on the barrier layer; depositing a tungsten nucleation layer on the ruthenium lay
|
