| http://www.w3.org/ns/prov#value | - An adhesion layer, a nucleation layer, a seed layer, or an additional barrier layer may contain titanium, tantalum, tungsten, cobalt, ruthenium, nitrides thereof, silicides thereof, or alloys thereof and may be formed by a deposition process such as ALD, CVD, or PVD. Tantalum-containing barrier layer 320 may serve as a seed layer to promote the formation of metal layer 322 using, for example, elec
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