| http://www.w3.org/ns/prov#value | - nt 10) [0201]FIGS. 20A to 20G are sectional views for illustrating the manufacturing process of a semiconductor device according to Embodiment 10 of the present invention. [0202] The method for manufacturing the semiconductor device according to the present embodiment roughly is a method for manufacturing a semiconductor device in which a plurality of electro-thermal conversion elements and a plur
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