| http://www.w3.org/ns/prov#value | - According to a process of this kind, a material such as novolac and polyimide that can be readily dry-etched by oxygen plasma is deposited by spin coating on a substrate and planarized, a resist resistant to dry etching by oxygen is applied to the surface of the planarized layer, a pattern is formed, and then the pattern is transferred to the bottom layer by anisotropic etching by oxygen plasma.
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