About: http://webisa.webdatacommons.org/267589401

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	can be bonded on the bulk metal layer 352 for connecting the semiconductor chip 300 to another chip or a substrate, such as a printed circuit board.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com